Heat dissipation in 3D printed cellular aluminum nitride structures

The improvement of heat dissipation in electronic and energy devices is a challenge that can be addressed through the use highly porous materials. Presently, additive manufacturing 3D aluminum nitride described, different lattice patterns with porosities range 45–64 % are achieved by direct ink writing. All structures robust effective thermal conductivity (keff) for cuboid decreases 50–75 filament separation shows anisotropic characteristics, since keff along longitudinal axis scaffold up to six times greater than transversal one. Heat transfer during free cooling experiments cylinder scaffolds, after rapid heating at temperatures above 1000 °C, takes place radiation >500 °C convection complete process. time constants both processes decrease almost linearly designed parameters porosity rod separation.